Number of Layer : 1 - 20 Layer
Maximum Processing Area : 680 × 1000MM
Material : FR1, 22F, CEM-1, CEM-3, FR4,
High TG, Aluminum, Ceramic, Rogers
2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
Min Board Thickness : 10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM (59 mil )
16 Layer - 1.6MM ( 63 mil )
18Layer - 1.8MM ( 71 mil )
Thickness: ≤ 1.0MM,
Finished Board Tolerance:±0.1MM
Thickness Tolerance : 1.0MM≤Thickness≤6.5MM
Tolerance ± 10%
Twisting and Bending : ≤ 0.75%, Min: 0.5%
Range of TG : 130 - 215 ℃
Impedance Tolerance : ±10%, Min: ± 5%
Hi-Pot TestMax : 4000V/10MA/60S
HASL, With Lead
HASL Free Lead
Flash Gold
Surface Treatment : Immersion Gold
Immersion Silver
Immersion Tin
Gold Finger
OSP